Production method of conductive adhesive

　　Now there are many people do not understand some of the basic information of conductive glue, then as a manufacturer, we also need to explain briefly, in fact, this conductive glue is we can see everywhere, its structure is different, in industrial applications are played a very important role, so we must timely to understand its basic principle structure, This is conducive to faster understanding and use in use.

　　The intermediate contact of conductive particles produces a conductive channel, which makes the conductive adhesive conductive. The smooth contact between the particles in the adhesive lies in the hard base or dry noise of the conductive adhesive. Before the conductive glue is dry or dry, the conductive particles in the glue are independent, and they are not often in contact with each other, so they are in the insulating layer. After the conductive adhesive is dry or dry, because the organic solvent of the adhesive is painted and dried, the volume of the adhesive shrinks, so that the conductive particles can be stable and sustained between each other, and then show electrical conductivity. The main purpose of that is that if you do not understand the place at any time you can call our own mobile phone to ask, enter the official website can see the method of association, you can also go to consult the relevant online staff.

　　Tunneling forms a certain current path between particles, which can be regarded as a potential energy gap when the directional motion of free charge in conducting particles is affected. According to the concept of physics, for an external economic particle, even if its kinetic energy is less than the energy gap energy, it can not only reflect the surface, but also have the ability to cross the energy gap. This is called the penetration effect, also known as tunneling. The electron is an external economic particle and therefore has the ability to pass through the natural barrier between the energy gaps of conducting particles. The probability of electronic devices crossing the cable sheath is related to the thickness of the insulation layer and the error of the cable sheath gap energy and electronic energy. The smaller the thickness error, the greater the probability. Electrons over the cable sheath. When the thickness of the insulation layer is small to a certain value, electronic devices are very easy to cross this thin layer of cable sheath, so the cable sheath between the conductive particles will become a conductive layer. The conductive layer generated by the tunneling can be equivalent to a resistor and a power capacitor.

　　Conductive adhesive production method: Conductive adhesive is dry solid or dry after a certain conductive properties of the adhesive, it is generally based on the substrate epoxy resin and conductive filler as the main components, that is, conductive particles, conductive particles in the middle of the bonding effect of the substrate to complete the connection.

　　The conductive adhesives are assembled for microelectronic technology and include fillets and printed circuit boards, plating process substrates, metal material layers for porcelain devices, plastic shell connections, electrode connections and power sockets, close-connected components and flat holes across printed circuit boards, close-connected dielectric waveguides automatically tuned tight connections and hole repairs. Therefore, we should understand the application of conductive adhesive very clearly when using, and here we will follow to understand it.

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