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food pacifier feeder for baby.Conductive adhesive is mainly used for microelectronic technology installation

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food pacifier feeder for baby.Conductive adhesive is mainly used for microelectronic technology installation Home

food pacifier feeder for baby.Conductive adhesive is mainly used for microelectronic technology installation

source:Industry News release time:2024-03-04

  

  1. Conductive adhesive is mainly used in the installation of microelectronics technology, including fine transmission lines and packaging printing distribution lines, electroplating process substrates, ceramic adhesive metal layers, metal material car chassis connections, bonding transmission lines and pipe seats, bonding components and crossing packaging printing line flat holes, automatic tuning and hole repair of adhesive dielectric waveguides. Another application of electric adhesive is to bond electrode patches with magnetic field crystals in ferroelectric devices. Conductive adhesive can replace welding powder and crystals that tend to accumulate due to welding temperature during welding. The adhesive used for charging battery terminals is another main use of conductive adhesive when the welding temperature is not good. Conductive adhesive can generate sufficient strength connectors and can therefore be used as a construction adhesive.

  Conductive adhesive is used to replace welding where the welding temperature exceeds the strength of the oxide layer generated by welding. As a substitute crystal for tin lead solder, conductive adhesive has core application areas such as telephone and mobile communication systems; Broadcasting programs, television, electronic computers, and other fields; The automotive industry; Medical equipment; Handle electromagnetic compatibility testing (EMC) and other related tasks.

  2. The advantages and limitations of conductive adhesives

  In addition to the advantages of natural environment, conductive adhesive has advantages in terms of characteristics compared to tin lead solder:

  (1) A lower curing temperature is suitable for thermistor materials and non solderable raw materials.

  (2) It can provide a more accurate spacing level, especially for various conductive adhesives, which can be applied in situations with a spacing of only 200um. This has broad application prospects for the increasingly high-density and miniaturized electronic product assembly industry.

  (3) Can simplify the processing technology (for wave soldering, it can reduce the processing flow).

  (4) High cost performance ratio for maintenance. For thermosetting plastic conductive adhesive, after local heating again, electronic devices can be easily replaced; For conductive adhesives for thermosetting plastics, electronic device transfer can be achieved by locally heating them above Ts. Even after curing, there is no need to use chemical agents or sharp specialized tools to remove residues. A new adhesive can be directly used, and then heated and dried to solidify.

  Although conductive adhesive is a strong competitor to tin lead solder, it also has its own limitations:

  (1) Relatively low conductivity. For general electronic devices, most conductive adhesives can be applied, but for power electronic devices, careful selection is necessary, otherwise the conductivity may not meet the requirements;

  (2) The actual bonding effect is greatly influenced by the type of electronic device, PCB type, quality, and coating;

  (3) The time required for dry solidification is relatively long;

  (4) If epoxy resin conductive adhesive is used, safety needs to be ensured. The high cost-effectiveness of epoxy resin conductive adhesive is an advantage, but once it undergoes active reactions, there are also irritating or toxic substances that can cause skin allergies to the evaporated amines on the human skin. Therefore, operators need to receive safety education and training.


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