source:silicone plate manufacturers release time:2022-07-13
Silicone gel belongs to a category of silicone rubber products. The gelation effect can be widely used in medical, electronic and military construction, etc. In addition, silicone gel has a heat dissipation effect in the electronics industry, so it has long been tinnitus. With the continuous increase of electronic technology in our country, the running speed of various movements is constantly refreshing. From 2G to the current 5G era, the problem of power consumption and heat generation will naturally increase, so today I will briefly introduce the heat dissipation of silicone gel. What are the functions!
Mr. Xu Zhijun, the rotating CEO, once said: "Only in terms of chip power consumption, 5G is 2.5 times that of 4G." The increase in chip operating speed will increase power consumption and heat generation. How to solve the huge heating problem of smartphones? It does not imitate the traditional graphite heat dissipation and liquid-cooled heat pipe heat dissipation technology, and chooses a new type of thermal conductive material - thermal conductive silicone gel, which can more effectively solve its heat dissipation problem.
As a new type of thermally conductive silicone product material, thermally conductive gel can penetrate into small voids due to its excellent wettability due to its liquid properties, and completely cover the heating part to ensure low thermal resistance. It is applied to mobile phone chips. It can help the chipset to achieve efficient heat dissipation.
The thermal conductive gel can be cured at room temperature or by the heat generated by the chip itself, without the need for a separate curing process; a mechanized dispensing system can be used for dispensing, which helps to improve production efficiency; There is a rework problem in , thermally conductive silicone gel can be peeled off easily and without residue for rework. This will greatly reduce the wastage rate and save production costs for consumer electronics manufacturers.
Thermally conductive gel can meet the heat dissipation requirements of thinner, smaller and higher performance equipment, and can be used in LED chips, communication equipment, memory modules, IGBTs, other power modules, power semiconductors and other fields.
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